JPH0136267B2 - - Google Patents

Info

Publication number
JPH0136267B2
JPH0136267B2 JP56107071A JP10707181A JPH0136267B2 JP H0136267 B2 JPH0136267 B2 JP H0136267B2 JP 56107071 A JP56107071 A JP 56107071A JP 10707181 A JP10707181 A JP 10707181A JP H0136267 B2 JPH0136267 B2 JP H0136267B2
Authority
JP
Japan
Prior art keywords
thyristor
semiconductor chip
thyristors
circuit
transistor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP56107071A
Other languages
English (en)
Japanese (ja)
Other versions
JPS589373A (ja
Inventor
Yasunobu Inabe
Kanji Mukai
Hiroyasu Uehara
Tamotsu Ishikawa
Toshikatsu Shirasawa
Yoshitaka Sugawara
Yoshikazu Hosokawa
Yasuo Mikami
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Hitachi Ltd
NEC Corp
Nippon Telegraph and Telephone Corp
Oki Electric Industry Co Ltd
Original Assignee
Fujitsu Ltd
Hitachi Ltd
Nippon Telegraph and Telephone Corp
Oki Electric Industry Co Ltd
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd, Hitachi Ltd, Nippon Telegraph and Telephone Corp, Oki Electric Industry Co Ltd, Nippon Electric Co Ltd filed Critical Fujitsu Ltd
Priority to JP56107071A priority Critical patent/JPS589373A/ja
Publication of JPS589373A publication Critical patent/JPS589373A/ja
Publication of JPH0136267B2 publication Critical patent/JPH0136267B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D89/00—Aspects of integrated devices not covered by groups H10D84/00 - H10D88/00
    • H10D89/10—Integrated device layouts

Landscapes

  • Thyristors (AREA)
  • Thyristor Switches And Gates (AREA)
JP56107071A 1981-07-10 1981-07-10 半導体集積回路 Granted JPS589373A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56107071A JPS589373A (ja) 1981-07-10 1981-07-10 半導体集積回路

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56107071A JPS589373A (ja) 1981-07-10 1981-07-10 半導体集積回路

Publications (2)

Publication Number Publication Date
JPS589373A JPS589373A (ja) 1983-01-19
JPH0136267B2 true JPH0136267B2 (en]) 1989-07-31

Family

ID=14449743

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56107071A Granted JPS589373A (ja) 1981-07-10 1981-07-10 半導体集積回路

Country Status (1)

Country Link
JP (1) JPS589373A (en])

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0240662U (en]) * 1988-09-12 1990-03-20

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3731393A1 (de) * 1987-09-18 1989-04-06 Bosch Gmbh Robert Hochspannungsschalter
JPH02158153A (ja) * 1988-12-12 1990-06-18 Nec Corp 誘電体絶縁分離型半導体集積回路

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0240662U (en]) * 1988-09-12 1990-03-20

Also Published As

Publication number Publication date
JPS589373A (ja) 1983-01-19

Similar Documents

Publication Publication Date Title
US3634929A (en) Method of manufacturing semiconductor integrated circuits
US5773899A (en) Bonding pad for a semiconductor chip
US5027188A (en) Semiconductor integrated circuit device in which a semiconductor chip is mounted with solder bumps for mounting to a wiring substrate
US4855257A (en) Forming contacts to semiconductor device
US5220199A (en) Semiconductor integrated circuit device in which a semiconductor chip is mounted with solder bumps for mounting to a wiring substrate
US3566214A (en) Integrated circuit having a plurality of circuit element regions and conducting layers extending on both of the opposed common major surfaces of said circuit element regions
US5631181A (en) Method of making a monolithic diode array
JP3369391B2 (ja) 誘電体分離型半導体装置
US6133625A (en) Semiconductor device and method for manufacturing the same
US5436497A (en) Semiconductor device having a plurality of vertical type transistors having non-intersecting interconnections
JPH0136267B2 (en])
US3581166A (en) Gold-aluminum leadout structure of a semiconductor device
US4942446A (en) Semiconductor device for switching, and the manufacturing method therefor
US5148249A (en) Semiconductor protection device
JPS5999769A (ja) 半導体装置
JP4186346B2 (ja) 半導体装置
JP3238825B2 (ja) 面実装型半導体装置
US8809695B2 (en) Contact structure for an electronic circuit substrate and electronic circuit comprising said contact structure
JP2005501416A (ja) バンプブリッジを備える集積回路デバイス及びその製造方法
JPH0629466A (ja) 半導体集積回路
KR100332643B1 (ko) 반도체 소자
JP3372109B2 (ja) 半導体装置
JPH1084073A (ja) 半導体装置
JPH043980A (ja) 半導体装置
JPH05326844A (ja) 半導体集積回路